Annual Bloomberg Bucket Event 2013

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A silicon wafer, a thin slice of semiconductor material used in... Foto di attualitàAmerica del Nord,California,Composizione orizzontale,Continente americano,Dispositivo informatico portatile,Fetta,Finanza,Internet,Irvine,Magro,Materiale,Quartiere generale,Semiconduttore,Silicio,Stati Uniti d'America,Tecnologia,Tecnologia mobilePhotographer Collection: Bloomberg 2013 BloombergA silicon wafer, a thin slice of semiconductor material used in integrated circuits, is displayed at the headquarters of Broadcom Corp. in Irvine, California, U.S., on Friday, April 12, 2013. Broadcom Corp. is a maker of chips that help mobile devices connect to the Internet. Photographer: Patrick T. Fallon/Bloomberg via Getty Images